Breakthroughs in Chip assembly count on nanomaterials and microsystems
Today’s world is rapidly digitizing. Tech trends like Electric cars, 5G, Robotics and Industry 4.0 will change the way of living and set the pace for the global Chip Industry. At the dawn of new product life cycles, Nexperia is working towards the next generation of chip integration materials and assembly processes. Nexperia is the expert in high-volume production of discrete and MOSFET components and analog & logic ICs that meet the stringent standards set by the Automotive industry. With an absolute focus on efficiency, Nexperia consistently produces the essential semiconductors required by every electronic design in the world: more than 90 billion annually. In his talk, Joep Stokkermans will highlight two examples of current key enabling technologies in chip integration technology and back-end assembly. For Electrical Cars, Nexperia is developing a GaN and SiC products from new semiconductor materials that can deliver more power and operating frequency. These Wide Band Gap Semiconductors require Pb free, rugged interconnect technologies. The challenge is to comply with the full set of requirements of electrical and thermal performance as well as lifetime reliability. While world-wide progress has been made, technical barriers still exist for deployment in low-cost high-volume chip markets.
In the new Chip Integration Technology Centre in Nijmegen, applied research and development is required to enable emerging technologies for industry. The CITC is a field-labs initiative where Nexperia, TNO and TU Delft and SME’s participate in a project to meet the automotive product requirements. Core in the technology development are nano materials with their unique scale properties that may just have the potential to bridge the gaps. Besides new interconnect processes, a next generation microelectronics assembly technology is emerging to enable low-cost mass-transfer assembly. From an analysis of the current monolithic hardware centric state-of-the-field, the next generation of mechanisms and technology principles can be predicted. Key drivers for this development trend are the mega power savings opportunity of over a factor of 106, and the crossing the cost barrier for mass volume markets. Joep will sketch the contours of this paradigm shift that over the next decade will radically change the way we know high-volume chip assembly. New driving principles and precision microsystems concepts are required to meet flexibility at a breakthrough low-cost level. As a vertically integrated company, Nexperia has the in-house competences to develop assembly& test equipment and manufacturing infrastructure. These are key enablers to support the future technology transitions of its products and essential for introducing efficient and green manufacturing technologies.
Biography Joep Stokkermans
Joep Stokkermans MSc (M) is Innovation Director at Nexperia Equipment & Automation Technologies Department. Joep graduated in Precision Engineering from Delft University of Technology in 1997. He started his career at Philips Semiconductors, in the E&A department which is per today part of Nexperia. First a a system architect and later as development team leader his focus was on the development of semiconductor assembly equipment and related technologies. After a short period in Asia for setting-up a service and supply chain department in Hong Kong he is now responsible for the predevelopment activities of Nexperia Equipment& Automation Technologies. Nexperia E&A has a strong working relationship with the TU Delft, department of Precision and Microsystems Engineering and participates in NERI, the NanoEngineering Research Initiative, with the mission to bring Nano from lab to app.
Day: Tuesday December 10th
Where: Manufacturing & Engineering
Time: 14:00h – 14:30h