Miniaturization in nanotechnology
December 3, 9:45-11:15
Semiconductor package miniaturization, what is needed to perform Failure Analysis on complex 3D packages
Thijs Kempers, MASER Engineering B.V.
Semiconductor packages are becoming more and more complex. To get more functionality on the same footprint, smaller 3D packages are needed. The complexity of the new 3D packages will bring new challenges when it comes to performing Failure Analysis. A wider variety of techniques and a lot more steps are needed to analyse the failure compared to a standard semiconductor package. These additional steps are needed to prevent losing the failure during the analysis. This presentation will show an overview of the techniques needed to perform Failure analysis on complex packages and the challenges we have encountered.
Thijs Kempers is the CEO of MASER Engineering. He graduated in 2009 as BSc in Chemistry at the Saxion University of Applied Sciences in Enschede, The Netherlands. He has worked as a Physical Analysis Engineer for 5 years before he joined the sales team. After working at MASER for almost 10 years, Thijs was appointed as CEO in December 2020. MASER Engineering B.V. is an independent service provider for diagnostics and test services of micro-electronic components and systems and is offering these services since 1993. MASER Engineering is located in Enschede, The Netherlands with sales offices in the United Kingdom, Germany, Belgium and Israel.